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<channel>
	<title>PD Simulation</title>
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		<title>Webinar &#8211; New to FEA</title>
		<link>http://www.pdsim.com/resources-centre/references/webinar-new-to-fea/</link>
		<comments>http://www.pdsim.com/resources-centre/references/webinar-new-to-fea/#comments</comments>
		<pubDate>Thu, 24 Feb 2011 07:20:04 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[References]]></category>
		<category><![CDATA[Resources Centre]]></category>
		<category><![CDATA[NEi]]></category>
		<category><![CDATA[Tutorial]]></category>
		<category><![CDATA[Webcast]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=2055</guid>
		<description><![CDATA[A comprehensive Introduction to Finite Element Analysis by Nei Nastran]]></description>
			<content:encoded><![CDATA[<p><a href="http://www.pdsim.com/wp-content/uploads/2011/02/Nei_webinar.gif"><img class="size-full wp-image-2056 alignnone" style="margin: 10px;" title="Introduction to FEA by NEi Nastran" src="http://www.pdsim.com/wp-content/uploads/2011/02/Nei_webinar.gif" alt="" width="465" height="156" /></a></p>
<p>Research conducted by the Aberdeen group has found that Engineering Managers are using FEA to improve product performance and development efficiency in order to address shortened time-to-market constraints.</p>
<p>For engineers and engineering managers new to Finite Element Analysis (FEA), structural testing through simulation can be greeted with apprehension. This reluctance to use FEA leads to increases in manufacturing costs, waste, and excesses in testing.</p>
<p><strong>This presentation demystifies the FEA process </strong>by examining the underlying technology that is used. It also looks at best practices and common mistakes to avoid.</p>

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			<li id="li-2-6" class=""><label for="cf2_field_6"><span>Designation</span></label><input type="text" name="cf2_field_6" id="cf2_field_6" class="single fldrequired" value="Designation" onfocus="clearField(this)" onblur="setField(this)" title="Please enter your designation"/><input type="hidden" name="cf2_field_6_regexp" id="cf2_field_6_regexp" value="^(?!Designation$)" title="Please enter your designation"/><span class="reqtxt">(required)</span></li>
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			<li id="li-2-10" class=""><label for="cf2_field_10"><span>Current FEA Software</span></label><input type="text" name="cf2_field_10" id="cf2_field_10" class="single" value="-" title="Please enter your current FEA Software"/><input type="hidden" name="cf2_field_10_regexp" id="cf2_field_10_regexp" value="-" title="Please enter your current FEA Software"/></li>
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<p>PD Solutions will never rent, share, or sell your information. Your privacy is very important to us, and we take our privacy commitment to our website users very seriously.</p>
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<h4>Incoming search terms:</h4><ul><li>user</li><li>FEA Best Practices Seminar</li><li>FEA webinar</li><li>nei nastran</li><li>Webinar motor FEA</li></ul><!-- SEO SearchTerms Tagging 2 plugin took 0.704 ms -->]]></content:encoded>
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		</item>
		<item>
		<title>Lambda Research Corporation Announces the Release  of TracePro 7.0, Optomechanical Design Software with multi-threading capability</title>
		<link>http://www.pdsim.com/latest-news/lambda-research-corporation-announces-the-release-of-tracepro-7-0-optomechanical-design-software-with-multi-threading-capability/</link>
		<comments>http://www.pdsim.com/latest-news/lambda-research-corporation-announces-the-release-of-tracepro-7-0-optomechanical-design-software-with-multi-threading-capability/#comments</comments>
		<pubDate>Thu, 24 Feb 2011 07:04:11 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[News]]></category>
		<category><![CDATA[TracePro]]></category>
		<category><![CDATA[Update]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=2049</guid>
		<description><![CDATA[Featuring a new interactive optimizer, rearrangeable system tree, new Reptile™ geometries and irradiance options.  ]]></description>
			<content:encoded><![CDATA[<p><strong>Littleton, Massachusetts – September 30, 2010</strong> – TracePro 7.0 increases raytracing speed up to 10 times over our 6.0 version using new multi-threading algorithms. This release also features a new interactive optimizer, rearrangeable system tree, new Reptile™ geometries and irradiance options.</p>
<p>TracePro 7.0 uses multi-threaded algorithms to raytrace on all the cores in Intel or AMD multi-core CPUs. Simulations done on a Dual Quad core computer show raytracing improvement of up to 10 times over previous releases when simulating LED, lighting, display, biomedical and aerospace systems.<a href="http://www.lambdares.com/news_and_events/press_releases/TracePro%207%20press%20release.pdf"><img class="size-full wp-image-2051 alignright" style="margin: 10px;" title="TracePro Version 7" src="http://www.pdsim.com/wp-content/uploads/2011/02/tracepro7.gif" alt="" width="302" height="295" /></a></p>
<p>The new interactive optimizer is specifically designed for nonsequential design on LED and illumination systems. The optimizer features a sketch utility for quick design entry, interactive raytrace for design verification, downhill simplex optimizer with interactive entry of target specifications.</p>
<p>Other new features include a rearrangeable system tree to create assemblies and standard drag and drop operations to arrange parts and assemblies. Two new irradiance options have been added including a new rainbow palette and normalization for stray light point source transmittance calculations. TracePro 7.0 also adds two new RepTile geometries, a flattened and pointed cone for the backlight display simulation.Based in Littleton, Mass., Lambda Research Corporation was founded in 1992 and is a privately held company.  Lambda is an industry leader in stray light analysis, illumination system design and analysis, and custom software development.  Lambda Research publishes TracePro<sup>®</sup> software for optomechanical modeling and OSLO<sup>®</sup> software for optical design.  The company’s mission statement is to establish a technology bridge between optical engineers and mechanical engineers by providing state-of-the-art optomechanical design and analysis software, services and technical support to the optics industry worldwide.</p>
<p>For more information, please visit the company’s web site at <a href="http://www.lambdares.com/news_and_events/press_releases/TracePro%207%20press%20release.pdf" target="_blank">www.lambdares.com.</a></p>
<h2>TracePro 7.0.3 highlights</h2>
<div id="_mcePaste"><em>(Released on January 12th 2011)</em></div>
<div id="_mcePaste">
<ul>
<li>  Update: Fix issued related to saving and reading source files</li>
<li>  Update:  Remove installer conflict with other services running on ports 6001 and 6002</li>
<li>  Update: Fix errant flux report on submitted model</li>
<li>  Update: Fix bad raytrace results on submitted model</li>
<li>  Update: Update help: source file format to indicate values that are not used</li>
<li>  Update:  Allow more facets for Faceted Splines raytracing and 3D Irradiance Map</li>
<li>  Update:  Add macro command: (raytrace:  get-surface-source-total-rays)</li>
<li>  Update:  Replace the multi-threaded random number generator with one with a much longer period</li>
<li> Update: Fix bug with specifying lens apertures</li>
<li> <strong> TracePro Utilities Revisions…</strong>
<ul>
<li> General:
<ul>
<li> Update:  Fix CRI calculation bug</li>
</ul>
</li>
<li>  Interactive Optimizer:
<ul>
<li>New: Add online help</li>
<li>New:  Add new features to create ray fans and ray sequence</li>
<li>New:  Add the capability of settling assymetric candela target</li>
</ul>
</li>
</ul>
<ul>
<li>  Interactive Optimizer:
<ul>
<li>New:  Support new CASI file format:  [angle(deg), polar angle, BSDF</li>
<li>Update:  Fix the bug while exporting property file of Asymmetric BSDF table type</li>
</ul>
</li>
</ul>
</li>
</ul>
</div>
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		</item>
		<item>
		<title>What&#8217;s new in Moldflow 2011</title>
		<link>http://www.pdsim.com/latest-news/whats-new-in-moldflow-2011/</link>
		<comments>http://www.pdsim.com/latest-news/whats-new-in-moldflow-2011/#comments</comments>
		<pubDate>Thu, 24 Feb 2011 06:53:39 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[News Video]]></category>
		<category><![CDATA[Autodesk]]></category>
		<category><![CDATA[Moldflow]]></category>
		<category><![CDATA[Update]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=2045</guid>
		<description><![CDATA[See what's new in Autodesk Moldflow 2011]]></description>
			<content:encoded><![CDATA[<h1 id="watch-headline-title">Autodesk Moldflow 2011 — New User Interface</h1>
<p>The new user interface for Autodesk Moldflow 2011 software provides an intuitive and task-oriented workflow, aimed at improving overall productivity.</p>
<p>A central and easy-to-navigate Home tab organizes common tasks in a manner that follows the typical simulation workflow. Functionality is presented based on the task at hand, which improves accessibility of commands and reduces time taken digging through menu systems.</p>
<p>The material database has been enhanced with Material Quality Indicators to reflect the confidence you can have in the material data selected for the type of simulation you want to perform.</p>
<p><iframe title="YouTube video player" width="550" height="339" src="http://www.youtube.com/embed/OYafeKT0t-A" frameborder="0" allowfullscreen></iframe></p>
<h1>Moldflow and Showcase — Photorealistic Defect Visualization</h1>
<p>Autodesk Showcase visualization software enables you to create accurate, highly realistic imagery from 3D CAD data. When coupled with the Autodesk Moldflow 2011 software, you can significantly enhance design reviews and quality assessments of plastic parts by examining a photorealistic rendering of the manufactured digital prototype.</p>
<p>This interoperability lets you see how the part might actually look in real life and determine whether the defects are visible to the eye, enabling you to assess part quality and decide whether the design needs to be changed to avoid downstream manufacturing defects.<br />
<iframe title="YouTube video player" width="550" height="339" src="http://www.youtube.com/embed/uekky8HoSLI" frameborder="0" allowfullscreen></iframe></p>
<h1>Autodesk Moldflow 2011 — Design Adviser</h1>
<p>Autodesk Moldflow Adviser 2011 software automatically checks your models on import and scans for defects in the geometry. The Design Adviser helps you quickly identify areas of plastic parts that violate design guidelines related to the injection molding manufacturing process</p>
<p><iframe title="YouTube video player" width="550" height="339" src="http://www.youtube.com/embed/fjyA9ZtZ7I4" frameborder="0" allowfullscreen></iframe></p>
<h1>Algor Simulation 2011 and Moldflow — Simulation of Plastic Parts</h1>
<p>Autodesk Algor Simulation users designing plastic parts can now access the extensive Autodesk Moldflow material database, containing grade-specific material properties for more than 8,000 thermoplastic resins.</p>
<p>For products that use a fiber-filled material, export your Autodesk Algor Simulation model to Autodesk Moldflow software in order to simulate the plastic injection molding process and help predict the orientation of fibers in the manufactured part.</p>
<p>With the combination of Autodesk Algor Simulation and Autodesk Moldflow software, you can better predict the real-life behavior of your plastic parts.</p>
<p><iframe title="YouTube video player" width="550" height="339" src="http://www.youtube.com/embed/jFB859iSM8w" frameborder="0" allowfullscreen></iframe></p>
<p>Learn more about Autodesk Moldflow 2011: <a title="http://www.autodesk.com/moldflow" dir="ltr" rel="nofollow" href="http://www.autodesk.com/moldflow" target="_blank">http://www.autodesk.com/moldflow</a></p>
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		<title>FloEFD and TracePro Hands-On Workshop 2011</title>
		<link>http://www.pdsim.com/latest-news/floefd-and-tracepro-hands-on-workshop-2011/</link>
		<comments>http://www.pdsim.com/latest-news/floefd-and-tracepro-hands-on-workshop-2011/#comments</comments>
		<pubDate>Wed, 16 Feb 2011 01:47:35 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[Webcast]]></category>
		<category><![CDATA[Events]]></category>
		<category><![CDATA[FloEFD]]></category>
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		<category><![CDATA[TracePro]]></category>
		<category><![CDATA[Workshop]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=2040</guid>
		<description><![CDATA[FloEFD and TracePro Hands-On Workshops]]></description>
			<content:encoded><![CDATA[<h1>FloEFD and TracePro Hands-On Workshops</h1>
<p><a href="http://www.pdsol.com/wp-content/uploads/2011/01/heading3.gif"><img class="size-full wp-image-2896 alignnone" style="margin: 10px;" title="heading" src="http://www.pdsol.com/wp-content/uploads/2011/01/heading3.gif" alt="" width="550" height="219" /></a>These two 3-hour workshops will provide an introduction to the FloEFD and TracePro software packages. The main goal of these workshops is to allow students to become familiar with the capabilities and use of FloEFD and TracePro, and show how they can be used to design better products with significant savings in time and money. Depending on their applications and requirements students may choose to attend one or both of these workshops.</p>
<p>In each workshop there will be a brief introduction lecture followed by hands-on tutorials and demonstrations to illustrate important points. A number of examples will be provided to show the student the key software capabilities, and how they can utilize these effectively over a range of different applications.</p>
<p>As an added bonus, all attendees will qualify for a <strong>free 30-day trial license </strong>of the software covered in each course they participate in.</p>
<h2><strong>What You Will Learn</strong></h2>
<p>In attending these workshops, you will learn the fundamental operation and functionality of these software packages, including:</p>
<ul>
<li>Range of software features and capabilities</li>
<li>Overall modeling process and methodology</li>
<li>Usage of the Graphical User Interface for model definition</li>
<li>Post-processing tools and analysis of results</li>
<li>Who Should Attend</li>
</ul>
<h2>Who Should Attend</h2>
<p><strong>FloEFD Workshop<a href="http://www.pdsol.com/wp-content/uploads/2011/01/FLoEFD_logo.gif"><img class="size-full wp-image-2878 alignnone" style="margin: 10px;" title="FLoEFD_logo" src="http://www.pdsol.com/wp-content/uploads/2011/01/FLoEFD_logo.gif" alt="" width="154" height="30" /></a><br />
</strong></p>
<ul>
<li>Mechanical engineers who wish to solve general flow and heat transfer problems</li>
<li>Electronics or thermal engineers working on electronics cooling design and system thermal management</li>
<li>HVAC and building engineers who wish to know how to improve ventilation equipment and system design</li>
</ul>
<p><strong>TracePro Workshop<a href="http://www.pdsol.com/wp-content/uploads/2011/01/tracepro-logo.gif"><img class="size-full wp-image-2879 alignnone" style="margin: 10px;" title="tracepro-logo" src="http://www.pdsol.com/wp-content/uploads/2011/01/tracepro-logo.gif" alt="" width="133" height="30" /></a><br />
</strong></p>
<ul>
<li>Optical engineers who wish to solve problems in light refraction and reflection</li>
<li>Lighting engineers who wish to improved the efficiency and quality of their designs</li>
<li>Display engineers who wish to improve the quality and uniformity of light in their designs</li>
</ul>
<h2>When</h2>
<p><strong>Singapore:</strong> 18 February 2011, Friday</p>
<p>FloEFD &#8211; 9:15 am &#8211; 12:15 pm (AM Session)</p>
<p>TracePro &#8211; 2 pm &#8211; 5 pm (PM Session)</p>
<p><strong>Penang: </strong>10 March 2011, Thursday</p>
<p>FloEFD &#8211; 9:15 am &#8211; 12:15 pm (AM Session)</p>
<p>TracePro &#8211; 2 pm &#8211; 5 pm (PM Session)</p>
<h2><span style="color: #ff0000;"><span style="text-decoration: underline;"><a href="http://www.pdsol.com/wp-admin/post.php?post=2873&#038;action=edit">Register Here</a></span></span></h2>
<p><em><span style="font-size: xx-small;">**Earliest registrations will be given priority<br />
**Maximum of 2 attendees per company or division</span></em></p>
<p>Thanks and we look forward to you joining us!</p>
<h4>Incoming search terms:</h4><ul><li>floefd pro 10</li><li>floEFD</li><li>tracepro</li><li>TracePro free seminars</li><li>Flo EFD pro free</li><li>tracepro thermal</li><li>cfd floefd hvac</li><li>solar simulation tracepro</li><li>trace pro logo</li><li>tracepro examples</li></ul><!-- SEO SearchTerms Tagging 2 plugin took 0.039 ms -->]]></content:encoded>
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		</item>
		<item>
		<title>NEi Stratus &#8211; An Introductory Mobile FEA App</title>
		<link>http://www.pdsim.com/latest-news/nei-stratus-an-introductory-mobile-fea-app/</link>
		<comments>http://www.pdsim.com/latest-news/nei-stratus-an-introductory-mobile-fea-app/#comments</comments>
		<pubDate>Wed, 16 Feb 2011 01:32:52 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[News Video]]></category>
		<category><![CDATA[iPad]]></category>
		<category><![CDATA[iPhone]]></category>
		<category><![CDATA[Mobile App]]></category>
		<category><![CDATA[NEi]]></category>
		<category><![CDATA[Simulation]]></category>

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		<description><![CDATA[Finite Element Analysis Powered by NEi Nastran and Cloud Computing Technology]]></description>
			<content:encoded><![CDATA[<p><img class="size-full wp-image-2036 alignnone" style="margin: 10px;" title="NEi Mobile" src="http://www.pdsim.com/wp-content/uploads/2011/02/NEi.jpg" alt="" width="550" height="145" /></p>
<p>WESTMINSTER, CA, Feb 11, 2011 &#8211; NEi Software debuts its free FEA mobile application, NEi Stratus, at the Pacific Design &amp; Manufacturing 2011 show as the company continues to innovate how and when finite element analysis solutions can be delivered to engineers. With this current application, finite element analysts can explore how mobile technology can be used to perform basic analysis, viewing results on their iPhone and iPad anywhere and anytime. The company sees the potential of combining cloud technology with the power of NEi Nastran solvers and believes this initial exploration into the combination will allow for more complex analysis as the technology matures.</p>
<p>NEi Stratus will be available by the beginning of the second fiscal quarter and will be initially offered at no charge. Those interested in viewing demos of this free mobile FEA application and staying up-to-date on NEi Software products should visit<a href="http://www.nenastran.com/mobile">http://www.nenastran.com/mobile</a>.</p>
<p><iframe title="YouTube video player" width="550" height="443" src="http://www.youtube.com/embed/tk8ExBhgR5U" frameborder="0" allowfullscreen></iframe></p>
<p><iframe title="YouTube video player" width="550" height="443" src="http://www.youtube.com/embed/PEymx0G4cq0" frameborder="0" allowfullscreen></iframe></p>
<p>&#8220;As innovators in CAE, NEi Software recognized two rapidly advancing technologies that have great potential within the CAE industry, mobile applications and cloud computing. NEi Stratus leverages these technologies to give engineers on-demand Nastran-based analysis,&#8221; said Mitch Muncy, Manager of Presales and Technical Support for NEi Software.</p>
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		<title>Mentor Graphics Announces FloTHERM v9 for CFD</title>
		<link>http://www.pdsim.com/latest-news/mentor-graphics-announces-flotherm-v9-for-cfd/</link>
		<comments>http://www.pdsim.com/latest-news/mentor-graphics-announces-flotherm-v9-for-cfd/#comments</comments>
		<pubDate>Tue, 02 Nov 2010 16:49:41 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[News]]></category>
		<category><![CDATA[CFD]]></category>
		<category><![CDATA[Mentor Graphics]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=2030</guid>
		<description><![CDATA[Mentor Graphics Announces FloTHERM Software with Industry’s First Thermal Analysis Bottleneck and Shortcut Innovation]]></description>
			<content:encoded><![CDATA[<p><strong>WILSONVILLE, Ore., October 25, 2010</strong>—Mentor Graphics Corporation (NASDAQ: MENT) today announced industry-first capabilities in the next generation of its <a href="http://www.mentor.com/products/mechanical/products/flotherm">FloTHERM® 3D computational fluid dynamics (CFD)</a> software for electronics cooling applications. The patent-pending technology in the FloTHERM software provides Bottleneck (Bn) and Shortcut (Sc) fields so that, for the first time, engineers can now identify where heat flow congestion occurs in the electronic design and why. It also identifies thermal shortcuts to quickly and efficiently resolve the design problem.</p>
<p>Together, the Bn and the Sc fields elevate the use of simulation from an observation tool which identifies heat management problems to an effective thermal design problem-solving tool which suggests potential solutions to the designer. The end result is faster and more efficient resolution of heat management problems.</p>
<p>“The value of FloTHERM 9 is in the time and the cost it saved us when developing an IC for a new generation of Energy Star-compliant mobile phone chargers. The baseline simulation using the ‘bottleneck’ feature quickly highlighted a potential thermal issue, and further iterations confirmed our solution,” stated Nigel Heather, vice president of engineering, CamSemi. “To achieve the same result by building prototype boards would have taken a long time and drawn resources away from other critical work. FloTHERM has helped us reduce development costs and kept our project on track to meet our customer’s aggressive deadline.”</p>
<p>For years, the FloTHERM software has been the industry leader in thermal analysis, used worldwide as a fast and accurate computational fluid dynamics solver. FloTHERM software reduces thermal verification by 33% and reduces PCB design re-spins by 500% compared to other solutions, according to a survey conducted by the Aberdeen Group (Electronics Correct by Design Benchmark Study, February 2007).</p>
<p>These innovations position FloTHERM to revolutionize the way designers solve their heat management challenges. The Bn field shows where in a design the heat path is being congested as it attempts to flow from high junction temperature points to ambient. Design changes to these bottlenecks can help solve the heat flow problem. The Sc field highlights possible solutions where the addition of a simple element to the design will provide a new effective heat flow path to further cool the system.</p>
<p>Using these two new technologies in conjunction with FloTHERM’s classic thermal analysis will enable designers to more quickly arrive at a better solution. Instead of experimenting with trial and error solutions, they will be guided with intelligent suggestions based on the Bn and Sc fields.</p>
<p>“Mentor’s focus on solving the electronics industry’s IC and systems power dissipation problems extends through the entire flow,” stated Erich Buergel, general manager, Mentor Graphics Mechanical Analysis Division. “By providing thermal simulation and testing solutions which span the entire process—starting with ICs and packages, through to PCBs and finally the complete electronic system—we are addressing the entire spectrum of the problem. Now this new Bn and Sc technology adds a new dimension to our solution.”</p>
<p>Two additional enhancements have been made in the new FloTHERM v.9 product: XML model and geometry data importing to enable FloTHERM integration into existing data flows, and a direct interface to the Mentor Graphics® Expedition® PCB design platform. The direct interface enables users to import native Expedition PCB data, and delete or edit additional objects (heatsinks, thermal vias, board cutouts, EM cans) for more accurate thermal model design development.</p>
<p>The FloTHERM product allows engineers to implement virtual prototypes using advanced CFD techniques to simulate airflow, temperature and heat transfer in electronic systems. This capability enables accurate thermal analysis so engineers can evaluate and test designs automatically before physical prototypes are built. The FloTHERM software is compatible with other Mentor products to provide comprehensive thermal simulation for optimum system reliability, from IC package to PCB and full system development.</p>
<p>Source: <a href="http://www.mentor.com/company/news/flotherm-innovation">Mentor Graphics</a></p>
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		<title>Siemens PLM Software&#8217;s Latest Release of Femap Aimed at World-Class Product Development Productivity</title>
		<link>http://www.pdsim.com/latest-news/siemens-plm-softwares-latest-release-of-femap-aimed-at-world-class-product-development-productivity/</link>
		<comments>http://www.pdsim.com/latest-news/siemens-plm-softwares-latest-release-of-femap-aimed-at-world-class-product-development-productivity/#comments</comments>
		<pubDate>Tue, 26 Oct 2010 14:35:33 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[News]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=2022</guid>
		<description><![CDATA[Latest Release Makes Finite Element Modeling Faster, Easier and More Accurate for Improved Product Quality and Faster Time-to-Market]]></description>
			<content:encoded><![CDATA[<p>PLANO, Texas, October 20, 2010 - <a rel="isStringisInternal" href="http://www.plm.automation.siemens.com/en_us/" target="_self">Siemens PLM Software</a>, a business unit of the Siemens Industry Automation Division and a leading global provider of product lifecycle management (PLM) software and services, today announced the latest release of <a rel="isStringisInternal" href="http://www.plm.automation.siemens.com/en_us/products/velocity/femap/index.shtml" target="_self">Femap™ software</a>, the PC-based finite element modeling component of the <a rel="isStringisInternal" href="http://www.plm.automation.siemens.com/en_us/products/velocity/index.shtml" target="_self">Velocity Series™ portfolio</a> of PLM solutions. Femap 10.2 is an easy to learn and use high-performance solution with a 25 year history of excellence.</p>
<p>Femap 10.2 makes it faster and easier to create the meshed models used by engineers to simulate and analyze product performance using finite element analysis (FEA). The latest release includes unique features to help ensure model accuracy and to visually evaluate analysis results. The productivity enhancements in Femap 10.2 are aimed at streamlining the processes required to create accurate models that can determine the structural, dynamic, and thermal performance of complex engineered parts, assemblies, and systems.</p>
<p>“Femap is recognized throughout the global engineering community for its in-depth finite element modeling functionality and its best-in-class integration with the industry leading Nastran solver,” said Bill McClure, vice president of product development for Velocity Series, Siemens PLM Software. “Today’s announcement builds upon the usability of Femap with extended interactive modeling and analysis capabilities, and increased program performance. The combination of Femap with the industry standard solver <a rel="isStringisInternal" href="http://www.plm.automation.siemens.com/en_us/products/nx/simulation/nastran/index.shtml" target="_self">NX Nastran software</a>, delivers a world-class, easy to use analysis solution, or what we call ‘real FEA made easy’.”</p>
<h3>Faster, Easier, More Accurate Modeling and Analysis</h3>
<p>Femap 10.2 adds a wide variety of customer-driven enhancements and exclusive new features to improve the entire computer-aided engineering (CAE) process from pre-processing model creation, to solver integration, to post-processing data handling, visualization and analysis. The Interactive Meshing Toolbox introduced in Femap version 10 has added functionality that enables faster, interactive creation of the finite element mesh model. It also includes a new feature editing capability that allows the user to move features, such as holes or surfaces, while the meshed model is automatically updated to reflect the change.</p>
<p>A new topology optimization capability allows the user to apply loads and constraints to material encompassing the entire available design envelope, minimizing weight, and maximizing stiffness by removing unnecessary material to create an optimized shape. The suggested shape can serve as a starting point for successive iterations, significantly reducing the time needed to arrive at a final design.</p>
<p>Femap 10.2 contains several enhancements that improve the speed and accuracy of the post-processing analysis process, including a powerful new feature for working with beam elements. Users now have the ability to quickly and easily view the stress contours in beam cross sections, eliminating the need for time consuming iterative analysis and dramatically improving the ability to detect areas of concern. Faster data handling also enables Femap to process recovered output data in significantly less time, and a new post-processing toolbox consolidates functional elements in the user interface for enhanced ease-of-use.</p>
<p>Consistent with Siemens PLM Software’s open business model, Femap works with all of the industry’s leading FEA solvers. With Femap 10.2, the company further expands its already unsurpassed integration with Nastran® software with the support of a new edge-to-face contact feature for NX™ Nastran software. This level of solver integration and support help ensure accurate analysis results and interoperability in a broad range of engineering environments.</p>
<p>Femap 10.2 is scheduled for availability in October. For more information, please visit<a href="http://www.siemens.com/plm/femap" target="_blank">www.siemens.com/plm/femap</a>.</p>
<h4>Incoming search terms:</h4><ul><li>femap heatsink</li><li>femap multithread</li><li>femap multi thread</li><li>Siemens PLM femap 2 10</li><li>multithreading with femap</li><li>multithreading femap</li><li>femap solver pro mechanica</li><li>femap multithreading</li><li>comments on nei fusion and femap</li><li>femap moldflow</li></ul><!-- SEO SearchTerms Tagging 2 plugin took 0.014 ms -->]]></content:encoded>
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		<title>TracePro Seminar 2010</title>
		<link>http://www.pdsim.com/latest-news/tracepro-seminar-2010/</link>
		<comments>http://www.pdsim.com/latest-news/tracepro-seminar-2010/#comments</comments>
		<pubDate>Mon, 04 Oct 2010 08:52:49 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[Webcast]]></category>
		<category><![CDATA[Penang]]></category>
		<category><![CDATA[Seminar]]></category>
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		<category><![CDATA[Singapore]]></category>
		<category><![CDATA[Workshop]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=2005</guid>
		<description><![CDATA[Hardware and Software Solutions for the Characterization and Analysis of Optical Materials and Devices]]></description>
			<content:encoded><![CDATA[<p><strong>Hardware and Software Solutions for the Characterization and Analysis of Optical Materials and Devices</strong></p>
<p>PD Solutions is pleased to present a short seminar to introduce some of the latest technology in the measurement, characterization and analysis of optical materials and devices. The presenter will be Mr Michael Gauvin the Vice President of Lambda Research Corporation, an optics professional with over 25 years experience in the field of optical simulation and lighting design.</p>
<p>In this seminar he will introduce a new optical measurement instrument the ScatterScope3D, and describe how the data generated can be used to analyze surface scattering in leading optical simulation tools such as TracePro, Zemax, LightTools, FRED and ASAP. This will be followed by an update on the latest developments in the TracePro 7.0 simulation package, including the exciting new &#8216;Interactive Optimizer&#8217; utility and other new developments which are currently in progress.</p>
<p><strong>Who should attend: </strong>Optical design, simulation and testing engineers, and managers looking to improve the productivity of their optical and lighting design processes.</p>
<p><strong>When/Where:</strong><br />
Singapore: 18 October 2010, Monday<br />
Location: PD Solutions Office. Click <a href="http://www.pdsol.com/contact_us/singapore/" target="_blank">here</a> for more detail.</p>
<p>Penang, Malaysia: 19 October 2010, Tuesday<br />
Location: Eastin Hotel. Click <a href="http://www.eastin.com/index.php?mid=3367">here</a> for more detail.</p>
<p><strong>Agenda:</strong><br />
13:45       Registration<br />
14:00       Introduction to Lambda Research Corporation Products and Services<br />
14:15       Optical Surface Characterization with the ScatterScope3D (Presentation &amp; Hardware Demo)<br />
15:15       Break<br />
15:30       Update on TracePro 7.0, and Future Directions in Optical Simulation<br />
16:30       Q &amp; A<br />
16:45       Finish</p>
<p>Reserve your seat now at:</p>
<p><strong>REGISTRATION IS NOW CLOSED</strong></p>
<p><sup><span style="font-size: x-small;"><sup>**</sup>Admission is by approved registration only.<br />
<sup>**</sup>Limited up to two registrations per company or division<br />
<sup>**</sup>PDS reserve the right to the final decision regarding all registration matter.</span></sup></p>
<p>For further enquiries please contact us at <a href="mailto:david@pdsol.com">david@pdsol.com</a> or call David Byrne at +65 9730 3935</p>
<p><strong>Thanks, and we look forward to you joining us!</strong></p>
<p><strong>Speaker Details:</strong><br />
Mr. Michael Gauvin is the Vice President of Lambda Research Corporation, manufacturer of the TracePro opto-mechanical program used worldwide for optical and lighting design and analysis. He has been an optics professional for over 25 years working on projects ranging from reducing stray light in the Hubble Space telescope to redesigning the Bionix ear curette that won the MDEA award in 2005. He is a graduate of the University of Arizona with a Bachelor of Science from their System Engineering program and underwent graduate studies at the world renown University of Arizona’s Optical Science Center. Mr. Gauvin is a member of SPIE, IESNA, and OSA. He has written multiple publications for Laser Focus World, and Photonics Spectra and has given invited papers in lighting and display design for SPIE, and Optical Design and Fabrication conferences.</p>
<p><strong>About TracePro:</strong><br />
<strong><span style="font-weight: normal;"><a href="http://www.pdsim.com/wp-content/uploads/2010/10/sec_pic1.jpg"><img class="alignright size-full wp-image-2008" style="margin: 10px;" title="TracePro" src="http://www.pdsim.com/wp-content/uploads/2010/10/sec_pic1.jpg" alt="" width="280" height="150" /></a>TracePro is a comprehensive, versatile software tool for modeling the propagation of light in imaging and non-imaging opto-mechanical systems. Models are created by importing existing designs from compatible lens design and CAD programs or directly in TracePro. You can use Boolean operations to unite, subtract, and intersect objects to create more complex parts. The program uses a re-arrangeable system tree to group or layer parts in any order for manageability, and to quickly apply optical materials and surface properties. Sources are modeled using a variety of methods including emission from source geometry, ray or bitmap files, lamp and LED catalogs, grid sources or a combination of the above methods. Rays from these sources are propagated through the model with portions of the flux of each ray allocated for absorption, specular reflection, transmission, fluorescence, birefringence, polarization, and scattering. Output information is designed to be intuitive and easy to export. Complete graphical, ray and textual information makes analysis easy to understand, and allows detailed evaluation of multiple design iterations in the minimum amount of time. More about <a href="http://www.pdsim.com/category/simulation/optical-modelling/tracepro/" target="_blank">TracePro</a></span></strong></p>
<p><strong>About ScatterScope3D: </strong></p>
<p><strong></strong><a href="http://www.pdsim.com/wp-content/uploads/2010/10/scatterpro.jpg"><img class="alignleft size-full wp-image-2009" style="margin: 10px;" title="ScatterPro 3D" src="http://www.pdsim.com/wp-content/uploads/2010/10/scatterpro.jpg" alt="" width="280" height="150" /></a>Lambda Research Corporation is the exclusive international distributor of the ScatterScope3D from ScatterMaster. This hardware equipment does a full scatter measurement (transmissive and reflective) which is needed for any surface to be characterized for use in any optical simulation program, whether it be TracePro, Zemax, LightTools, FRED or ASAP. This product outputs SEMI format which is directly readable by any of these products in terms of scatter information. The product is exportable to all countries since it uses a USB port using less than 5 volts and meets US restrictions for export of scatterometers in almost all markets, especially the lighting and display market. The product comes complete with a Dell computer for analyzing and displaying data. Taking a measurement is quite simple, anyone can be trained in about 4-8 hours. More About <a href="http://www.lambdares.com/news_and_events/press_releases/Joint Press Release from ScatterMaster and Lambda" target="_blank">ScatterScope3D</a></p>
<h4>Incoming search terms:</h4><ul><li>fred vs tracepro</li><li>zemax vs tracepro</li><li>tracepro vs fred</li><li>scatterScope3D</li><li>tracepro tutorial</li><li>tracepro vs zemax</li><li>TracePro or FRED</li><li>tracepro</li><li>TracePro 7 0</li><li>tutorial tracepro</li></ul><!-- SEO SearchTerms Tagging 2 plugin took 1.151 ms -->]]></content:encoded>
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		<title>Mentor Graphics Signs PD Solutions as New Distributor for Computational Fluid Dynamics (CFD) Products  in Singapore and Malaysia</title>
		<link>http://www.pdsim.com/latest-news/mentor-graphics-signs-pd-solutions-as-new-distributor-for-computational-fluid-dynamics-cfd-products-in-singapore-and-malaysia/</link>
		<comments>http://www.pdsim.com/latest-news/mentor-graphics-signs-pd-solutions-as-new-distributor-for-computational-fluid-dynamics-cfd-products-in-singapore-and-malaysia/#comments</comments>
		<pubDate>Fri, 13 Aug 2010 07:19:58 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[News]]></category>
		<category><![CDATA[CAD]]></category>
		<category><![CDATA[CAE]]></category>
		<category><![CDATA[CAM]]></category>
		<category><![CDATA[Corporate]]></category>
		<category><![CDATA[FloTHERM]]></category>
		<category><![CDATA[Mentor Graphics]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=1994</guid>
		<description><![CDATA[PD Solutions has signed as a distributor of Mentor Graphics® FloEFD™, FloTHERM® and FloVENT® products, targeting mechanical design engineers in Singapore and Malaysia.]]></description>
			<content:encoded><![CDATA[<p><strong>WILSONVILLE, Ore., August 12, 2010</strong>—Mentor Graphics Corporation (NASDAQ: MENT) today announced the signing of PD Solutions as a distributor of the Mentor Graphics® <a href="http://www.mentor.com/products/mechanical/products/floefd/">FloEFD™</a>,<a href="http://www.mentor.com/products/mechanical/products/flotherm"> FloTHERM®</a> and <a href="http://www.mentor.com/products/mechanical/products/flovent">FloVENT®</a> products, targeting mechanical design engineers in Singapore and Malaysia. The Mechanical Analysis Division (MAD) of Mentor Graphics portfolio of CFD software, which includes the industry-leading FloEFD product, provides a wide range of physical simulation and analysis capabilities involving heat transfer and fluid flow before physical prototyping.</p>
<p>PD Solutions, founded in 2003, provides CAD/CAM/CAE and product lifecycle management (PLM) software and services to companies in the design and manufacturing industries. As the region’s main reseller of PTC software and certified training, PD Solutions helps customers realize the value of CAD-embedded CFD for upfront and concurrent CFD design simulation and analysis. These capabilities help customers eliminate product design errors, reduce costs, and optimize overall product quality.</p>
<p>“With the distribution of Mentor’s CFD solutions in Singapore and Malaysia, we will provide our customers with the industry’s best, innovative and comprehensive technology that is also fast and easy to use,” said Tay Ming Hui, PD Solutions’ managing director. “By providing design engineering, implementation, consulting, software migration and training, we will enable our customers to remain competitive and successful by improving their efficiency and time-to-market through Mentor’s industry-leading mechanical design and analysis technology.”</p>
<p>&#8220;Having PD Solutions distribute our CFD product line is of strategic importance for us, since they provide unprecedented experience and a successful approach to our target customers in Singapore and Malaysia,” said Erich Buergel, Mentor Graphics Mechanical Analysis Division general manager. “The combination of our industry-leading CFD technology and PD Solutions’ expertise and comprehensive services will allow us to expand into new markets very quickly while enabling our customers to develop innovative new products.&#8221;</p>
<p>Source: <a href="http://www.mentor.com/company/news/cfd-singapore-malaysia" target="_blank">Mentor Graphics</a></p>
<h4>Incoming search terms:</h4><ul><li>cfd resellers</li><li>cfd fluid dynamics malaysia</li><li>mentor graphics malaysia</li><li>Mentor Graphic Malaysia</li><li>mentor graphics singapore events</li><li>mentor singapore reseller</li><li>pd solutions singapore</li><li>pro-e reseller in malaysia</li><li>pro-e software seller in malaysia</li><li>mentor graphics singapore</li></ul><!-- SEO SearchTerms Tagging 2 plugin took 0.354 ms -->]]></content:encoded>
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		<title>FloTHERM® PCB v6.1 Continues to Improve Board Level Thermal Analysis Efficiency by Removing the Barriers to Data Flow with the World of EDA</title>
		<link>http://www.pdsim.com/latest-news/flotherm%c2%ae-pcb-v6-1-continues-to-improve-board-level-thermal-analysis-efficiency-by-removing-the-barriers-to-data-flow-with-the-world-of-eda/</link>
		<comments>http://www.pdsim.com/latest-news/flotherm%c2%ae-pcb-v6-1-continues-to-improve-board-level-thermal-analysis-efficiency-by-removing-the-barriers-to-data-flow-with-the-world-of-eda/#comments</comments>
		<pubDate>Fri, 13 Aug 2010 06:36:42 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Latest News]]></category>
		<category><![CDATA[News]]></category>
		<category><![CDATA[FloTHERM]]></category>
		<category><![CDATA[FloTHERM PCB]]></category>
		<category><![CDATA[Mentor Graphics]]></category>
		<category><![CDATA[pcb thermal analysis]]></category>

		<guid isPermaLink="false">http://www.pdsim.com/?p=1988</guid>
		<description><![CDATA[FloTHERM PCB is designed to be used by all those involved in the conceptual design of PCBs, including product marketing, systems architects, hardware designers, and mechanical/thermal specialists.]]></description>
			<content:encoded><![CDATA[<p>FloTHERM PCB is designed to be used by all those involved in the conceptual  design of PCBs, including product marketing, systems architects, hardware  designers, and mechanical/thermal specialists. It interfaces with several major  Electronic Design Automation (EDA) tools such as Boardstation, Expedition,  Allegro and CR5000. Removing the data transfer barrier between the EDA design  and the thermal analysis greatly facilitates collaboration among the various  groups, particularly during the conceptual phase of the design process. <a href="http://www.pdsim.com/wp-content/uploads/2010/08/FloTHERM-PCB.jpg"><img class="alignright size-full wp-image-1989" title="FloTHERM-PCB" src="http://www.pdsim.com/wp-content/uploads/2010/08/FloTHERM-PCB.jpg" alt="" width="256" height="332" /></a></p>
<p>FloTHERM PCB promotes a conceptual design process that is based  on the ease of data transfer which enables any changes to be reflected in the  physical layout and thermal representations quickly and accurately. This keeps  all team members in sync and enables them to contribute to concept development  in real-time. The result is pre-optimized concepts in less time and drastic  reductions in late-cycle rework as product marketing, mechanical engineering,  thermal and manufacturing issues are solved before concept commit.</p>
<p>See more detail <a href="http://www.mentor.com/products/mechanical/blog/post/minimizing-late-stage-pcb-respins-adc65bed-78ba-4de8-b6ef-4766059e191e?contactid=1&amp;PC=L&amp;c=2010_08_03_mad_electronic_cooling_technical_news" target="_blank">here</a></p>
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